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- Manufacturer No：XC4013XL-3HT176C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC4013XL-3HT176C
- SKU：5176606
- Description：XC4000E/X XC4013XL 176-LQFP Exposed Pad TIN LEAD field programmable gate array 1.6mm 3.3V 166MHz 1.6ns
User Guide
User Guide
XC4013XL-3HT176C Details
XC4000E/X XC4013XL 176-LQFP Exposed Pad TIN LEAD field programmable gate array 1.6mm 3.3V 166MHz 1.6ns
XC4013XL-3HT176C Specification Parameters
- Mounting Type: Surface Mount
- Radiation Hardening: No
- Part Status: Obsolete
- Operating Supply Voltage: 3.3V
- Speed Grade: 3
- JESD-609 Code: e0
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 0.5mm
- Terminal Finish: TIN LEAD
- Voltage - Supply: 3V~3.6V
- Subcategory: Field Programmable Gate Arrays
- Operating Temperature: 0°C~85°C TJ
- Length: 24mm
- Number of Terminations: 176
- Number of Outputs: 192
- Number of Equivalent Gates: 10000
- Number of Logic Cells: 576
- Number of LABs/CLBs: 576
- Package / Case: 176-LQFP Exposed Pad
- Combinatorial Delay of a CLB-Max: 1.6 ns
- Number of Registers: 1536
- Number of Gates: 13000
- Base Part Number: XC4013XL
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Supply Voltage: 3.3V
- Packaging: Tray
- Lead Free: Contains Lead
- Terminal Form: GULL WING
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Height Seated (Max): 1.6mm
- Terminal Position: QUAD
- Published: 1999
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Clock Frequency: 166MHz
- Width: 24mm
- Pin Count: 176
- Number of Inputs: 192
- Number of I/O: 145
- Number of CLBs: 576
- Series: XC4000E/X
- Total RAM Bits: 18432
- RAM Size: 2.3kB
- JESD-30 Code: S-PQFP-G176
- Number of Logic Elements/Cells: 1368
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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